Very interesting, what they did is a kind of an "super-SoC". They managed to put many things on top of common CMOS digital circuits: reram and mems.

The idea has merit for one big reason: if you can put memory on same die as the core you can largely eliminate the memory bottleneck.

Totally Awesome. 3D is definately the way to go, even a few extra layers would vastly improve performance if you can get around the heat problems